Specification
1.Material:FR4 +PI 0.2MM
2.Layer: 4 layer
3.Board Thickness: 1.2mm
4.Copper Thickness:0.75 OZ
5.Min. Line Width: 0.5mm
6.Min. space :0.5mm
7.Solder mask color :Green, Red, White, Yellow, Black, Blue
Detailed Specification of Flexible PCB Manufacturing
Technical Specification | ||
Layers: | 1~10 (flex Pcb) and 2~8 (rigid flex) | |
Min Panel Size: | 5mm x 8mm | |
Max Panel Size: | 250 x 520mm | |
Min Finished board thickness: | 0.05mm (1 sided inclusive copper) | |
Max Finished board thickness: | 0.3mm (2 sided inclusive copper) | |
Finished board thickness tolerance: | ±0.02~0.03mm | |
Material: | Kapton, Polyimide, PET | |
Base copper thickness (RA or ED): | 1/3 oz, 1/2 oz, 1oz, 2oz | |
Base PI thickness: | 0.5mil, 0.7mil, 0.8mil, 1mil, 2mil | |
Stiffner: | Polyimide, PET, FR4, SUS | |
Min Finished hole diameter: | Φ 0.15mm | |
Max Finished hole diameter: | Φ 6.30mm | |
Finished hole diameter tolerance (PTH): | ±2 mil ( ±0.050mm) | |
Finished hole diameter tolerance (NPTH): | ±1 mil ( ±0.025mm) | |
Min width/spacing (1/3oz): | 0.05mm/0.06mm | |
Min width/spacing (1/2oz): | 0.06mm/0.07mm | |
Min width/spacing (1oz): | Single layer: 0.07mm/0.08mm | |
Double layer: 0.08mm/0.09mm | ||
Aspect Ratio | 6:01 | 8:01 |
Base Copper | 1/3Oz--2Oz | 3 Oz for Prototype |
Size Tolerance | Conductor Width：±10% | W ≤0.5mm |
Hole Size： ±0.05mm | H ≤1.5mm | |
Hole Registration： ±0.050mm | ||
Outline Tolerance：±0.075mm | L ≤50mm | |
Surface Treatment | ENIG: 0.025um - 3um | |
OSP: | ||
Immersion Tin: 0.04-1.5um | ||
Dielectric Strength | AC500V | |
Solder Float | 288℃/10s | IPC Standard |
Peeling Strength | 1.0kgf/cm | IPC-TM-650 |
Flammability | 94V-O | UL94 |
